Product introduction
This product is designed to reinforce cement mortar wall surfaces, aerated concrete block surfaces, and other substrates such as putty powder, paint, and cement mortar. It is especially effective on absorbent substrates like concrete. By sealing capillary pores and cracks, it significantly reduces the absorption of porous surfaces.
This prevents moisture in the leveling layer from being rapidly absorbed by the substrate, thereby enhancing the bonding strength between the leveling layer and the substrate. This results in a secure adhesion that eliminates common issues like peeling, flaking, cracking, and bubbling.
Performance characteristics
>> Water-based emulsion, eco-friendly and safe for the environment
>> Superior penetration, making application effortless
>> Combines sealing, penetrating, and hardening in one solution
>> Ideal for direct interface treatment, boosting substrate strength, sealing, and reducing absorption
>> Significantly enhances bonding strength, ensuring firm adhesion between the leveling layer and the substrate, effectively preventing peeling, flaking, cracking, and bubbling
>> Versatile application for both wall and floor substrates
Substrate Treatment
Ensure the substrate surface is smooth & dry, free from cracks, oil stains, & other chemical additives like release agents. For loose or heavily sand-shedding surfaces, avoid using this product and opt for shot blasting instead. Sand the substrate and vacuum thoroughly before application.
>> Clear the floor surface of any unstable loose materials and oil stains..
>> Dilute the hardener with water in a 1:1 to 1:2 ratio or as per substrate absorption, and apply a coat with a roller brush to ensure full penetration..
>> For enhanced reinforcement, multiple coats can be applied..
>> Once cured, the substrate is ready to be directly treated with putty powder, anti-crack mortar, plastering, surface mortar, or self-leveling cement.
TechnicalData |
Appearance |
White Emulsion with blue light |
(25ºC)PH |
7±] |
Solid Content |
17±2 |
Minimum film forming temperature |
5ºC |
Package |
5kg-10kg-20kg |